Antenna-in-Package Technology and Applications
English | 409 pages | True PDF | 22 Mb
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A comprehensive guide to antenna design, manufacturing processes, antenna integration, and packaging.
Antenna-in-Package Technology and Applications contains an introduction to the history of AiP technology.
It explores antennas and packages, thermal analysis and design, as well as measurement
setups and methods for AiP technology. The authors—well-known experts on the
topic—explain why microstrip patch antennas are the most popular and describe the
myriad constraints of packaging, such as electrical performance, thermo-mechanical reliability,
compactness, manufacturability, and cost. The book includes information on how the
choice of interconnects is governed by JEDEC for automatic assembly and describes low-temperature
co-fired ceramic, high-density interconnects, fan-out wafer level packaging–based AiP,
and 3D-printing-based AiP.